DX-7CZ Unit to Bond Silicon Mono-Crystal Ingot
Function: it is specially used to bond a silicon mono-crystal ingot, which gets oriented with DX-7C X-Ray Orientation Unit from this company first and then gets bonded on it, in operation it is applied together with a multi-line cutter.
Characteristics: there is a location plate, controlled by 2 SCMs and driven by step motor so as to adjust the location and angle of the ingot on the wire saw plate. As for the viscose glue to solidify it takes time and let efficiency occur, the unit can in the meantime hold 3 plates and, on each one, it could bond several shorter blocks of ingot, but for “ remeasurement “ it can only bond 2 blocks.
Technical Data:
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item
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data
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input power supply
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mono-phase AC 220 V，50 Hz，0.3 KW.
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tube voltage max.
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30 kV
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overall dimension
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1290（L）x772（W）x1300（H）mm
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Unit weight
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300kg。
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ingot diameter
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3-8 inches
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ingot lengthmax.
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500 mm
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wire saw
plate length
max.
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500 mm
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wire saw
plate widths
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70 mm,100 mm,150 mm
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location plate turning（&）
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±10°
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turning-angle
reading min.
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1"
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