Model DX-5-6
Function:
it is used to bond crystal ingot before cutting it. With crystal-ingot Plane R as diffraction one, under x-rays, test it and have it bonded, when it can bond layers of material with adjustable article pad. At the left goniometer test a high-precision wafer, at the right side it is the set to bond a crystal ingot.
Model DX-5 is special for an ingot on wire saw plate to be bonded at 35° inclining to the left( ingot+ Plane X upward ), Model DX-6 is special for an ingot on wire saw plate to be bonded at 35° inclining to the right( ingot+ Plane X downward ).
Technical Data:
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item
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data
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input power
supply
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mono-phase AC 220 V，50 Hz，0.3 KW.
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tube voltage
max.
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30 kV
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tube current
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0-5 mA continuously
adjustable
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receiver
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Geiger counter，work voltage max. DC 1 050 V
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x-ray tube
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copper target, cooling
fan, grounded anode
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measured angles
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2θ=－10～120°，θ=－5～60°。
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comprehensive precision
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±15″（measured with standard quartz plane 10ī1）
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reading min.
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1″
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overall dimension
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1140（L）x650（W）x1100（H）mm
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weight
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300 kg
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