Model DX-5C
Function:
With crystal-ingot Plane R as the diffraction one, sticking does under x-rays. We suggest apply it together with a multi-line cutter.
Characteristics: in high precision.
Technical Data:
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item
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data
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wire-saw plate size
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330×200×2
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ingot thickness
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13 mm
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layer(s) to be bonded
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1
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precision of ingot to
be bonded onto wire-saw plate
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±5"
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way to show bonding
precision
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digital/analog rate has
function in memory of peak value
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cut-angle reading min.
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1"
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wire-saw plate to be
fixed
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with electromagnet
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wire-saw plate to be
moved
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special-precision guide
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